Gloved hand holds a wafer for microelectronics packaging

Packaging

The Institute for Matter and Systems Packaging Facilities provide advanced infrastructure and toolsets supporting a wide range of packaging research and development activities.

Welcome to the Georgia Tech Packaging Facilities

Our Packaging Facilities provide advanced infrastructure and state-of-the-art tools that support a wide range of packaging research and development activities. The facilities enable processes including lithography, lamination, redistribution layer (RDL) and through-glass via (TGV) metallization, laser drilling, chip embedding, and silicon wafer processing such as physical and chemical vapor deposition, electroplating, and deep reactive ion etching.

Equipped to accommodate substrates and packages up to 300 mm by 300 mm, the facilities support applications in high-performance computing, artificial intelligence, automotive systems, millimeter-wave communications, and photonics. These capabilities give researchers, faculty, and industry partners access to advanced processing and characterization tools that accelerate innovation in packaging and heterogeneous integration. The facilities also collaborate closely with interdisciplinary research groups to advance developments in materials, design, thermal management, and assembly technologies.

About Us

Tool Directory: Explore our full list of packaging tools here.

Rates & Billing: View current usage rates and billing policies on our Rates & Fees page.

Safety Information: Your safety is our top priority. Access safety protocols, emergency procedures, and training materials here.

Contact Us: Our expert staff is here to support your research. Learn more about the cleanroom team and how to contact them here.

Facilities Policy: All users are required to follow our policies at all times.​

Getting Started

Become A User: New users must complete onboarding and training. Start by learning more about how to use our facilities.​

Reserve Tools: Once approved, you can schedule time on cleanroom equipment through SUMS.​

Review Safety Information: Familiarize yourself with our safety procedures to ensure a safe and productive environment for all users.

Access to the packaging tools is managed through the campus-wide Shared User Management System (SUMS).