![Boston micro fabrication 3D printer in the Georgia Tech biocleanroom](/sites/default/files/2024-06/boston-micro-3d-printer_0.jpeg)
Boston Micro Fabrication s140 3D Printer
The BMF microArch S140 is the ideal solution for researchers requiring ultra-high resolution, accuracy, and precision in a desktop micro 3D printer. The microArch has a large build volume (94x52x45mm) and the ability to print with engineering-grade materials (photosensitive resins) to meet the needs of industrial production and quality. With an optical resolution of 10μm and layer thickness of 10-40μm, the S140 can produce surface finishes of 0.4 - 0.8μm Ra (top) and 1.5 - 2.5μm Ra (side).
BMF microArch is the first commercialized high-resolution, 3D microfabrication equipment based on PμSL technology. Projection Micro Stereolithography allows for rapid photopolymerization of a layer of liquid polyer using a flash of UV-LED at micro-scale resolution.
Experience the fast and easy production of microstructures by importing your STL file and exposing your design directly to accelerate your work in the areas of microfluidics, MEMS, filtration, electronics, medical devices, and other applications that require microstructures.
![OxfordFlex ALD tool in the micro/nano fabrication cleanroom at the Institute for Matter and Systems](/sites/default/files/2024-07/oxford%20flex%20ald%20copy.png)
Oxford FlexAL ALD
This popular tool is capable of plasma ALD and thermal ALD processes within a single process chamber. The Oxford FlexAL ALD is designed to grow layer-by-layer thin films while ensuring precise control, film conformity, and film repeatability. It uses heated precursors to deposit various metals along with gases for plasma-assisted oxides and nitrides.
![The Heidelberg MLA 300 in the Georgia Tech cleanroom](/sites/default/files/2024-06/heidelbergMLA300.png)
Heidelberg MLA 300
This maskless lithography system is designed for easy operation to develop photoresist films. The Heidelberg MLA streamlines prototyping cycles and achieves the highest optical quality and precision. It uses a light to expose many types of photoresists including thicker and harder to reach layers.
The Maskless Aligner MLA 300 provides high throughput, a simplified workflow, and integration with manufacturing execution systems. With a minimum feature size of 1.5 um, the MLA 300 can expose up to 12" wafer sizes. Real-time autofocus compensates for substrate warp or corrugations, ensuring flawless patterning. Utilizing this tool, researchers will spend less time writing circuit patterns, thus shortening the lag between prototyping and production while maintaining superior critical dimension (CD) uniformity.
![The Heidelberg MLA 150 in the Georgia Tech cleanroom](/sites/default/files/2024-06/mla-150.jpeg)
Heidelberg MLA 150 #2
The Heidelberg MLA 150 #2, located in the Marcus Inorganic cleanroom. This maskless lithography system is designed for easy operation to directly develop photoresist films. The Heidelberg MLA streamlines prototyping cycles by allowing patterns to be exposed directly and offers topside alignment. It uses a light to expose many types of photoresists including thicker and harder to reach layers.
The MLA 150 #2 stands out due to its high exposure speed, accommodates any size and shape, and has flexible pattern changes. It can expose an area of 100 x 100mm2 with structures as small as 0.6um and an alignment accuracy of 500nm between layers. This tool can support two wavelengths of 375nm and 405nm, a substrate minimum size of 1.5cm x 1.5cm and perform topside alignment. We hope this tool will greatly aid researchers who are working in the areas of Life Science, MEMS, Micro-Optics, Semiconductor, and other applications.
![Optec femtosecond micro-machining system](/sites/default/files/2024-06/optect_WS_flex_USP_system.png)
Optec Femtosecond Laser
The Georgia Tech Optec Femtosecond Laser is an OPTEC WS-Flex USP system that uses a femtosecond laser to process practically any material through ultra-short laser pulses photo-ablation. The ultra-short laser pulse is effective on polymers, metals, ceramics, glass, single crystals, and polymorphic crystals. Materials are ionized by the laser pulse and removed from the surface in a plasma cloud, leaving a clean surface at the interaction site. Contrary to typical thermal laser operations, the femtosecond laser is not as sensitive to wavelength absorption and creates minimal thermal gradients, therefore leaving no heat-affected zones on processed materials.
Applications include cutting, milling, drilling, tube processing, composite material cutting, scribing, and surface structuring.
![The Exaddon Ceres 3D metal printer](/sites/default/files/2024-06/ceres_UAM.png)
Exaddon CERES μAM
The Exaddon CERES μAM system prints microscale metal objects by electrodeposition. The system is optimized for printing free-standing microscale structures such as pillars, needles, coils, and lattices on existing surfaces, such as ICs or wafers.
Printing occurs at room temperature, and no post-processing is necessary. This system can print Gold, Copper, and Nickel. The printable size range is 1 μm – 1 mm, resolution < 1 μm, and structures can be located on print surfaces with <1 μm accuracy. This makes it ideal for applications in brain-machine interfaces, semiconductor surface modification, Photonics, Drug Delivery, and HF communication components.
![AJA Nitride multisource sputterer in the Marcus inorganic cleanroom at Georgia Tech](/sites/default/files/2024-06/AJA-nitride-multisource-system_0.jpeg)
AJA Nitride Multisource Sputtering System
The Georgia Tech AJA Nitride Multisource Sputtering System deposits thin metal and nitride films in argon and nitrogen-enriched low vacuum. The AJA Sputterer has 4 magnetron sputtering guns, 2 DC power sources, 3 RF power sources, and a heater that can reach up to 800°C. It also has the capability of pulse dc. RF Bias is also available up to 50W. It can process wafers up to 4" -Deposition Processes: Aluminum, Aluminum Nitride, Titanium, Titanium Nitride, W, Mo, Ta, and Tantalum Nitride.
![FlexAL atomic layer deposition system](/sites/default/files/2024-06/flexAL-atomic-layer-deposition_0.jpeg)
FlexAL Atomic Layer Deposition System
The FlexAL atomic layer deposition (ALD) system offers a broad range of optimized high-quality plasma ALD and thermal ALD processes with maximum flexibility in precursors, processes gases, and hardware configuration within a single process chamber.
Features include:
- Remote plasma for low damage plasma ALD combined with thermal ALD in one deposition chamber
- RF biased electrode option available for control of film properties
- Industry-standard cassette to cassette handling for higher throughput
- Maximum flexibility in the choice of precursors, process gases, hardware features and options
- Optimized to maintain low-damage, high-quality substrates
- Removable liners allow for easy chamber maintenance
- Low temperature to enable high-quality deposition on temperature-sensitive surfaces
![The disco automatic dicing saw in the marcus inorganic cleanroom.](/sites/default/files/2024-06/dicing-saw_0.png)
Disco Automatic Dicing Saw
The Disco Automatic Dicing Saw (DAD 3361) is an automated dicing saw that can handle 12-inch wafers and smaller substrates. The common blades are 80um thick and can cut glass and silicon substrates up to about 1mm thickness. For FR4, sapphire and other materials, special purpose blades can be used. The DAD3361 is commonly used to cut silicon wafers, but can also handle products of a variety of sizes and materials, such as large package substrates, electronic parts including SAW filters, and more. It has a wide selection of options available to improve processing quality to reduce running costs and improve its ability to process hard-to-cut materials. Alternative uses of the system can include the creation of trenches or scribing lines on substrates to aid in subsequent separation of small dies. The system also incorporates a semiautomatic and automatic alignment system to allow researchers at various levels of training successful use of the system. Substrates to be cut on the system are affixed to the dicing frame and chuck table with a UV release tape to allow for a strong adhesion during dicing and easier removal of diced substrates after the dicing process.
![The Veeco Fiji G2 Atomic Layer Deposition system in the Marcus inorganic cleanroom at Georgia Tech.](/sites/default/files/2024-06/veeco-ald-system_0.jpeg)
Veeco Fiji G2 Atomic Layer Deposition System
The Veeco Fiji G2 Atomic Layer Deposition (ALD) System is a modular, high-vacuum ALD system that can accommodate a wide range of deposition modes using a flexible architecture and multiple configurations of precursors and plasma gases. The Fiji G2 is a next-generation ALD system capable of performing thermal and plasma-enhanced deposition. It has advanced features including a proprietary chamber turbo pumping system, fast process time, and improved plasma design.
The Veeco Fiji G2 ALD System has a 200 mm (8”) chuck with fully automatic loading and unloading function. The process temperature can be up to 500°C, and plasma power up to 300 W. The layer thickness can be controlled to angstrom resolution, and uniformity of layer thickness is within 1% across the deposition area. It can generate high quality oxide and nitride films for semiconductor manufacturing, MEMS, solar cells, etc.