Disco DAS8930 Surface Planar
The Disco DAS8930 is a high-precision planarization system designed to process substrates up to 12-inch wafers using a single-axis, single-chuck table configuration. It effectively planarizes a broad range of materials, including metals, resins, and composites. This tool is essential for minimizing bump height variation and reducing surface roughness, making it ideal for advanced packaging and surface preparation workflows.
DISCO DAG810 Grinder
Designed for wafers up to 8 inches, the DAG810 features an in-feed grinding mechanism capable of handling materials such as silicon, SiC, and sapphire. It supports smaller, irregular samples mounted on grinding tapes or carrier wafers. Equipped with an in-process thickness gauge, it enables precise control over material removal, ensuring consistent thickness throughout the grinding process.
Disco DAD3361 Dicing Saw
The DISCO DAD3361 is a semi-automatic dicing saw engineered for high-precision cutting of silicon, glass, FR4, and SiC materials. Capable of processing wafers up to 300 mm in diameter, it boasts a robust bridge-type frame with advanced servo-controlled axes and high-speed spindle options, ensuring excellent stability and accuracy during cutting operations.
Buehler AutoMet 250 Automatic Polisher
The AutoMet 250 is an automated grinder-polisher ideal for consistent, high-quality sample preparation. It processes up to six samples simultaneously (each up to 1.5 inches in diameter), applying grinding forces up to 90 N. Compatible with a wide range of grinding papers and polishing slurries, this system is perfect for both routine metallography and precise surface finishing.
Buehler Ecomet 6 Polisher (grinder)
Configured for manual polishing of cross-sectioned substrates, the Ecomet 6 supports silicon carbide polishing papers and various polishing felts for slurry-based finishing. It offers hands-on control and flexibility, enabling users to achieve exceptional surface finishes tailored to their sample needs.
Bruker Tribolab CMP
IMS is equipped with two Bruker Chemical Mechanical Polishing (CMP) systems designed for precise polishing of metals and oxides on wafers up to 4 inches. These systems feature advanced polishing and conditioning heads, allowing for tight process control and highly uniform surface finishes—critical for advanced material and device fabrication.
Disco DFS8910 Surface Planar
The fully automated Disco DFS8910 planarization system processes wafers up to 8 inches and excels at planarizing ductile materials such as metals, resins, and composites. It effectively reduces bump height variation and surface roughness, ensuring high-precision results throughout multilayer substrate fabrication.