ESI CornerStone ICP Series 1 Laser Drilling System
This high-performance UV laser operates at 355 nm wavelength with up to 16 W power and an 80 MHz pulse repetition rate. Capable of processing samples up to 300 mm × 300 mm, it can drill up to 10,000 microvias per second. Specifically designed for microvia fabrication in dielectric materials, it offers outstanding accuracy and throughput tailored for advanced packaging applications.
OPTEC Femtosecond Laser Micro-Machining Systems
The OPTEC femtosecond lasers provide ultra-precise, thermal-free machining with ultra-short pulses, suitable for a variety of materials including polymers, metals, ceramics, glass, and crystals. Featuring a 300 × 300 mm travel range and submicron resolution, these systems support diverse applications such as cutting, drilling, milling, and surface structuring. Advanced features like galvo scanners and IFOV heads expand machining versatility, making them ideal for microfluidics, photonics, and advanced materials engineering.