ClassOne Solstice S8 Automated Electroplating System

The ClassOne Solstice S8 is a versatile, automated plating system designed to support a broad range of electrolytic plating processes critical to advanced packaging. Featuring an 8-chamber configuration, it handles substrates up to 4” and 8” wafers and includes a vacuum pre-wet chamber to ensure optimal surface preparation prior to plating. Key capabilities include sub-micron copper redistribution layer (RDL) plating, high-aspect-ratio copper filling for through-silicon vias (TSVs), and electrolytic NiW deposition for durable wear-resistant coatings and stitch interconnects. The system also supports SnAg plating for chip bumping and electrolytic gold plating for high-performance interconnect applications.

Chemcut Plating Line

This integrated plating line supports processing of 300 mm panels and offers comprehensive plating and surface preparation capabilities, including:

• Desmear: Removes dielectric residue from microvia walls using swelling, permanganate etching, and neutralization, enhancing adhesion for electroless copper plating.
• Electroless Seed Layer Deposition: Deposits thin (~100–300 nm) copper seed layers inside high-aspect-ratio through-holes and blind microvias.
• Electrolytic Plating: Provides multiple plating modes for copper deposition, including pulse reverse power for through-hole filling, microvia filling and conformal plating.
  Additional baths support micro-etching, acids, and bases. The system employs various agitation methods — rack oscillation, air vibration, ultrasonics, air bubbling, and eductor mixing — to ensure uniform plating quality and process efficiency.