Meiki MVLP300/300-s Vacuum Laminator
Designed for precision lamination of dry films such as dielectrics and photoresists, the Meiki MVLP 300 combines advanced vacuum technology with finely tuned temperature and pressure control. Supporting wafers up to 300 mm, it operates across a broad temperature range (room temperature to 180°C) and applies pressures up to 1 MPa. Its multistage lamination process allows multiple pressure and timing sequences within a single cycle, making it ideal for complex packaging applications requiring accuracy and repeatability.
Laurell WS-650Mz-8NPPB Spin Coater
This high-speed spin coater accommodates wafers up to 8 inches and can reach speeds up to 12,000 rpm. It delivers uniform thin-film coatings essential for photoresist and dielectric layer deposition, ensuring excellent film quality for advanced packaging processes.
Tamerica Versalam-1300 Roll Laminator
Optimized for advanced packaging needs, the Tamerica Versalam-1300 supports samples up to 12 inches wide. It features adjustable lamination speed, customizable thickness settings, and heating up to 120°C, providing reliable lamination of dry film photoresists and dielectric materials with consistent quality.
Chemcut 2315D Spray Developer system
This conveyorized spray developer uses a 1% Na₂CO₃ solution tailored for negative-tone photoresist development. Its oscillating nozzles spray chemistry from both top and bottom, ensuring uniform coverage over samples up to 16 inches wide. The system is perfect for efficient, precise, and double-sided photoresist development in packaging workflows.
Yamato DN411IE Nitrogen Oven
A nitrogen-purged oven with three spacious shelves, capable of processing samples up to 300 mm. It reaches temperatures as high as 360°C with precise nitrogen flow control, programmable operation modes, and up to 99 repeatable process steps—ideal for thermal treatments that require an inert atmosphere.
Cure UV HTBX II UV LED Curing Oven
This high-intensity UV LED curing oven emits light in the 360–370 nm range with adjustable power output up to 800 mW/cm² in 1% increments. It accommodates samples up to 8” x 8”, delivering controlled curing for photoresists and other UV-sensitive materials with exceptional precision.
VWR Convection Oven
Featuring three shelves and capacity for samples up to 12” x 12”, this convection oven heats up to 250°C and includes a timer with automatic shutoff. It is commonly used for curing laminated dielectric films and other thermal processing steps in advanced packaging.
Plasma Etch PE200 Plasma Chamber
Equipped for surface activation and descum, this plasma chamber processes samples up to 12” x 12” on three shelves. Utilizing oxygen and argon gases at up to 250 W power, it ensures consistent plasma treatment to prepare surfaces for subsequent fabrication steps.
PHI Hot Press
This versatile hot press applies up to 30 tons of force with heated platens reaching 100°C, accommodating samples up to 300 mm. It is ideal for lamination, bonding, and molding applications where precise heat and pressure control are critical.