Finetech Fineplacer Sigma Flip Chip Bonder
The Finetech Sigma flip chip bonder delivers high-precision bonding for advanced packaging and micro-assembly. It supports heated substrates up to 4 inches and non-heated substrates up to 8 inches, accommodating chip sizes up to 10 mm × 10 mm. With fast thermal ramp rates—30°C/s for substrates (up to 450°C) and 20°C/s for chips (up to 400°C)—and bonding forces up to 1000 N, it offers reliable and efficient thermal processing. Features include gimbal-mounted tool tips with modular changers, a die flipper, and an integrated epoxy dispense module, providing versatile functionality for demanding applications.
Finetech Fineplacer Matrix Flip Chip Bonder
This advanced flip chip bonder supports thermocompression, thermosonic, and reflow bonding techniques, offering broad flexibility. It provides precise bonding force control from 0.1 N to 450 N, suitable for delicate or robust interconnects. With 3 µm alignment accuracy and support for substrates up to 100 mm × 100 mm, it is ideal for research and prototyping environments demanding high precision.
Finetech Fineplacer Lambda Flip-chip Bonder
A versatile flip chip bonder capable of thermocompression, thermosonic, and reflow bonding, offering bonding forces ranging from 0.1 N to 400 N. It supports substrate sizes up to 40 mm square, making it well-suited for advanced semiconductor packaging research and small-scale production.
Finetech Fineplacer Lambda Sub-Micron Flip-chip Bonder
This high-precision bonding system features programmable heating and cooling up to 400°C and precise bond gap control for optimal interconnect formation. With submicron placement accuracy better than 0.5 µm in X and Y axes, it ensures repeatable, reliable results. The system supports substrates up to 4 inches and chip sizes from under 1 × 1 mm up to 60 × 60 mm, with finely controlled bonding forces from 0.1 to 20 N at 0.1 N resolution. Its intuitive user interface and side-view camera facilitate enhanced alignment, making it ideal for high-accuracy R&D and production applications.
TPT HB16 Lecia S9E Wedge Bonder
Designed for precision aluminum wedge bonding, this wire bonder accommodates substrates up to 100 mm on a heated stage and supports 25 µm aluminum wire. It is ideal for fine-pitch, high-reliability microelectronic interconnects.
TPT HB16 Lecia S9D Wirebonder
This semi-automatic gold ball bonder features a motorized stage for precise positioning and ease of operation. It supports 25 µm gold wire and substrates up to 100 mm on a heated stage, delivering consistent high-quality bonds suitable for prototyping and low-volume production.
BTU PYRAMAX 100N 8 Zone Solder Reflow Oven
This conveyorized, 8-zone reflow oven provides precise thermal profiling and temperature control for medium-volume soldering production. Adjustable belt width accommodates various board sizes, offering flexibility for diverse packaging processes.
LPKF Protoflow S N2 Desktop Reflow Oven
A compact, computer-controlled reflow oven capable of processing substrates up to 9” × 12”. The inert nitrogen environment reduces oxidation during soldering, ensuring consistent, high-quality joints ideal for prototyping and small-scale manufacturing.
Seamark ZM-R730A Large Board BGA Rework Station
Designed for BGA and SMD rework, this station supports sample sizes up to 24” × 20.4”. It offers high-accuracy pick-and-place functionality with ±20 µm placement precision for components up to 80 mm × 80 mm, ideal for precise rework and assembly tasks.
ASYS EKRA X5 STS Screen Printer
This semi-automatic screen printer is optimized for solder paste deposition on PCBs and solar cells. With a printing area up to 200 mm × 200 mm (currently configured for 156 mm × 156 mm), it precisely controls print speed, squeegee pressure, and snap-off distance to ensure consistent, high-quality prints.
X-Carve Pro 4 x 2 CNC System
A precision CNC milling tool capable of fabricating PCBs and complex 3D designs, handling sample sizes up to 4 feet by 2 feet. Its versatility makes it ideal for prototyping and custom manufacturing in packaging development.